How To: Technique for Proflex NFC Overlay Resin

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Base Strengthener with NFC Overlay  |  NFC Overlay Resin

Pro-flex NFC Overlay Resin

The new NFC Resin is a fast-curing, flexible material that can be used separately or with the Pro-flex base strengthener to make flexible appliances. When used in conjunction with the strengthener, it has stronger flex capabilities. However, in many cases (small repairs, temporary appliances, quick add-on clasps, or clear splints) a strengthener is not desirable. For these cases, the following instructions can be used.

POUR INSTRUCTIONS FOR POUR FLASK

  1. NOTE: Diatoric holes should be drilled in teeth to ensure optimum retention. A bonding agent is highly recommended.
  2. Prepare hydrocolloid mold in regular manner.
  3. Remove Pro-flex powder and liquid resin from refrigerator.
  4. Add two parts of powder to one part of liquid. Use clear measuring cup for liquid (½ oz.) and add to (1 oz.) powder.
  5. Mix thoroughly as quickly as possible (10 seconds) and then pour cold mixture into hydrocolloid mold.
  6. Cure in pressure pot as soon as possible at 125° to 130° F. and 20 psi for 30 minutes. Do not cure at temperatures over 135° F or mix will not cure. Use thermometer to check temperature.
  7. Remove, pour denture mold from pressure pot and place under cold running tap water for 15 minutes. Remove denture from pour mold.

PRESS-PACKING INSTRUCTIONS FOR STANDARD FLASK

  1. NOTE: Diatoric holes should be drilled in teeth to ensure optimum retention. A bonding agent is highly recommended.
  2. Prepare stone/plaster denture mold using regular press-packing techniques.
  3. Remove Pro-flex powder and liquid resin from refrigerator.
  4. Add two parts of powder to one part liquid. Use clear measuring cup for liquid (½ oz.) and add to powder (1 oz.).
  5. Mix thoroughly as quickly as possible (10 seconds).
  6. As soon as mixture reaches a doughy state (5-8 minutes), pack into regular denture flask using normal press-packing procedures. Material is sticky, so you may want to wet your fingers or use cellophane when handling the NFC dough.
  7. Cure for 60 minutes in 125° to 130° F water. Do NOT cure at temperatures over 135° F or under 125° F.
  8. Cool for 15 minutes under running tap water. Remove from mold.

Base Strengthener with NFC Overlay  |  NFC Overlay Resin


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